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- High thermal conductivity
- Metal heaters, with their excellent thermal conductivity, achieve fast heating and efficient heat transfer in semiconductor manufacturing, thereby improving process speed and efficiency.
- Stability at high temperatures
- It operates reliably at high temperatures and makes it suitable for reliable high-temperature processes.
- Available in a wide selection of metals
- Various metal selections allow you to choose materials optimized for specific applications.
- High Strength and Durability
- Metal has high strength and durability, allowing it to withstand mechanical shocks and long-term use.
- Chemical stability
- Al2O3, YAG, and AlF3 coatings are applied using Anodizing, PVD, and ALD technologies to maintain chemical stability in various semiconductor manufacturing environments.
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Specification Size 200, 300mm(Wafer Size) Temperature uniformity <±1% Power 220V, 50/60Hz Max. Using Temp. 450℃ Heating Area 1~4 zone Surface Treatment Electropolishing, Bead Blasting
Anodizing, Ceramic Coating,
AlF3 Coat, Bead Blasting, PVD, ALDFunction Heating, RF Electrod, Vacuum chucking,
ESC ChuckingWelding Process TIG, FSW, P Type(By TTS) Welding,
Diffusion Bonding -
Supply process and equipment DxZ CENTURA WxZ CENTURA TxZ ENDURA PEDESTAL VECTOR PEDESTAL ALTUS HEATER ASM CVD/ALD
- Metal Heater
- info
- High thermal conductivity
- Metal heaters, with their excellent thermal conductivity, achieve fast heating and efficient heat transfer in semiconductor manufacturing, thereby improving process speed and efficiency.
- Stability at high temperatures
- It operates reliably at high temperatures and makes it suitable for reliable high-temperature processes.
- Available in a wide selection of metals
- Various metal selections allow you to choose materials optimized for specific applications.
- High Strength and Durability
- Metal has high strength and durability, allowing it to withstand mechanical shocks and long-term use.
- Chemical stability
- Al2O3, YAG, and AlF3 coatings are applied using Anodizing, PVD, and ALD technologies to maintain chemical stability in various semiconductor manufacturing environments.
-
Specification Size 200, 300mm(Wafer Size) Temperature uniformity <±1% Power 220V, 50/60Hz Max. Using Temp. 450℃ Heating Area 1~4 zone Surface Treatment Electropolishing, Bead Blasting
Anodizing, Ceramic Coating,
AlF3 Coat, Bead Blasting, PVD, ALDFunction Heating, RF Electrod, Vacuum chucking,
ESC ChuckingWelding Process TIG, FSW, P Type(By TTS) Welding,
Diffusion Bonding -
Supply process and equipment DxZ CENTURA WxZ CENTURA TxZ ENDURA PEDESTAL VECTOR PEDESTAL ALTUS HEATER ASM CVD/ALD
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