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- Electrostatic Chuck (ESC)
Electrostatic Chuck (ESC)
By applying an electric field between the wafer/glass surface and the electrodes in the ESC, an attractive force is exerted on the wafer/glass.
- Volumetric Resistance Control Technology (Johnson-Rahbek Model and Coulomb Force Model Available)
- Chucking and De-Chucking Time Control Technology
- Sealing Technology: Apply Al2O3 Ceramic Sealing Technology, secure withstand voltage of ~10 kV, and increase durability in corrosive environments.
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- Unipolar (monopolar) ESC
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F/A = ½εrεo (V/d)²
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- Bipolar ESC
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F/A = 1/8εrεo (V/d)²
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- Emboss Type Unipolar
ESC for D/E Process -
- Emboss Type Unipolar
-
- Flat Type Unipolar ESC
for D/E Process -
- Flat Type Unipolar ESC
-
- Fine Pitch Type Bipolar ESC
for Glass Transfer -
- Fine Pitch Type Bipolar ESC
- Electrostatic Chuck (ESC)
- info
Electrostatic Chuck (ESC)
By applying an electric field between the wafer/glass surface and the electrodes in the ESC, an attractive force is exerted on the wafer/glass.
- Volumetric Resistance Control Technology (Johnson-Rahbek Model and Coulomb Force Model Available)
- Chucking and De-Chucking Time Control Technology
- Sealing Technology: Apply Al2O3 Ceramic Sealing Technology, secure withstand voltage of ~10 kV, and increase durability in corrosive environments.
-
- Unipolar (monopolar) ESC
-
F/A = ½εrεo (V/d)²
-
- Bipolar ESC
-
F/A = 1/8εrεo (V/d)²
-
- Emboss Type Unipolar
ESC for D/E Process -
- Emboss Type Unipolar
-
- Flat Type Unipolar ESC
for D/E Process -
- Flat Type Unipolar ESC
-
- Fine Pitch Type Bipolar ESC
for Glass Transfer -
- Fine Pitch Type Bipolar ESC
- detail_img
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