Business Areas
Business
홈
- Business Areas
- Electrostatic Chuck (ESC)
Electrostatic Chuck (ESC)
By applying an electric field between the wafer/glass surface and the electrodes in the ESC, an attractive force is exerted on the wafer/glass.
- Volumetric Resistance Control Technology (Johnson-Rahbek Model and Coulomb Force Model Available)
- Chucking and De-Chucking Time Control Technology
- Sealing Technology: Apply Al2O3 Ceramic Sealing Technology, secure withstand voltage of ~10 kV, and increase durability in corrosive environments.
-
- Unipolar (monopolar) ESC
- F/A = ½εrεo (V/d)²
-
- Bipolar ESC
- F/A = 1/8εrεo (V/d)²
-
- Emboss Type Unipolar
ESC for D/E Process
- Emboss Type Unipolar
-
- Flat Type Unipolar ESC
for D/E Process
- Flat Type Unipolar ESC
-
- Fine Pitch Type Bipolar ESC
for Glass Transfer
- Fine Pitch Type Bipolar ESC
- Electrostatic Chuck (ESC)
- info
Electrostatic Chuck (ESC)
By applying an electric field between the wafer/glass surface and the electrodes in the ESC, an attractive force is exerted on the wafer/glass.
- Volumetric Resistance Control Technology (Johnson-Rahbek Model and Coulomb Force Model Available)
- Chucking and De-Chucking Time Control Technology
- Sealing Technology: Apply Al2O3 Ceramic Sealing Technology, secure withstand voltage of ~10 kV, and increase durability in corrosive environments.
-
- Unipolar (monopolar) ESC
- F/A = ½εrεo (V/d)²
-
- Bipolar ESC
- F/A = 1/8εrεo (V/d)²
-
- Emboss Type Unipolar
ESC for D/E Process
- Emboss Type Unipolar
-
- Flat Type Unipolar ESC
for D/E Process
- Flat Type Unipolar ESC
-
- Fine Pitch Type Bipolar ESC
for Glass Transfer
- Fine Pitch Type Bipolar ESC
- detail_img
-