Top menu shortcut Go to Body Body Submenu Shortcut Bottom

Business Areas

Business
서브비주얼 이미지
Electrostatic Chuck (ESC)
By applying an electric field between the wafer/glass surface and the electrodes in the ESC, an attractive force is exerted on the wafer/glass.
  • Volumetric Resistance Control Technology (Johnson-Rahbek Model and Coulomb Force Model Available)
  • Chucking and De-Chucking Time Control Technology
  • Sealing Technology: Apply Al2O3 Ceramic Sealing Technology, secure withstand voltage of ~10 kV, and increase durability in corrosive environments.
  • Unipolar (monopolar) ESC
    F/A = ½εrεo (V/d)²
  • Bipolar ESC
    F/A = 1/8εrεo (V/d)²
  • Emboss Type Unipolar
    ESC for D/E Process
  • Flat Type Unipolar ESC
    for D/E Process
  • Fine Pitch Type Bipolar ESC
    for Glass Transfer
Electrostatic Chuck (ESC)
Electrostatic Chuck (ESC)
info
Electrostatic Chuck (ESC)
By applying an electric field between the wafer/glass surface and the electrodes in the ESC, an attractive force is exerted on the wafer/glass.
  • Volumetric Resistance Control Technology (Johnson-Rahbek Model and Coulomb Force Model Available)
  • Chucking and De-Chucking Time Control Technology
  • Sealing Technology: Apply Al2O3 Ceramic Sealing Technology, secure withstand voltage of ~10 kV, and increase durability in corrosive environments.
  • Unipolar (monopolar) ESC
    F/A = ½εrεo (V/d)²
  • Bipolar ESC
    F/A = 1/8εrεo (V/d)²
  • Emboss Type Unipolar
    ESC for D/E Process
  • Flat Type Unipolar ESC
    for D/E Process
  • Fine Pitch Type Bipolar ESC
    for Glass Transfer
detail_img